Process Selector Guide
| Parameter/ Technology | 1um | 0.8 um | 0.6 um | 0.15 um | 0.1 um | 0.1 um | 0.25 um |
| power InP | digital InP | digital InP | GaAs Power | GaAs | InP | GaN | |
| HBT | HBT (2Met) | HBT (4Met) | PHEMT | PHEMT | PHEMT | HEMT | |
| Ft (peak) | 80 GHz | 160 GHz | >250 GHz | 80 GHz | 120 GHz | 180 GHz | 55 GHz |
| Fmax (peak) | 150 GHz | >200 GHz | >300 GHz | 200 GHz | 250 GHz | 350 GHz | 100 GHz |
| Beta/Gm | 25 | 80 | 80 | 550 | 650 | 1200 | 350 |
| mS / mm | mS / mm | mS / mm | mS / mm | ||||
| Vce / Vds (Max) | 7.5V | 5V | 4V | 5V | 4V | 1.2V | 25V |
| Current Density (Max) | 0.7 | 1.5 | 2.5 | 250 | 250 | 150 | 250 |
| mA / um² | mA / um² | mA / um² | mA / mm | mA / mm | mA/ mm | mA / mm | |
| Wafer Thickness | 75 um | 75 um | 75 um | 50 & 100 um | 50 & 100 um | 75 um | 100 um |
| Airbridged Metal Available | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Backside Vias | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Diode Type | Schottky | Schottky | Schottky | Gate Source | Gate Source | Gate Source | NA |
| Wafer Size | 100 mm | 100 mm | 100 mm | 100 mm | 100 mm | 100 mm | 3” |
| Highlight/ Application | • Mixed Signal designs | • Fiber Optic applications up to 25 Gbps | • Fiber Optic applications up to 40 & 100 Gbps | • High power amps < 5W up to 60 GHz | • Low Noise Amplifier up to 100 GHz | • Very Low noise Amplifiers | • Very high power amplifiers < 10W up to 40 GHz |
| • ADC/DAC | • High Speed digital circuitry | • High Speed digital circuitry | • Linear amplifiers | • Power amplifiers < 1W up to 100 GHz | • mmW sensors | ||
| • Driver amplifiers | • Low power dissipation | ||||||
| • Up/Dwn cnverters | • Up/Dwn cnverters | ||||||
| Commercial Qualification Date | TBD | NOW | Q1 2012 | NOW | NOW | NOW | NOW |
